FR4, four-layer board, impedance, communication, BGA, blind buried hole
Release time：2018/08/11 4-Layer PCB BGA Communication Device FR4 Impedance PCB with Blind buried holes viewed：979
Product Type: Multilayer Board
Material: FR4
Application area: data acquisition
Number of layers / plate thickness: 4L / 1.6mm
Surface treatment: Shen Jin
Line width / line spacing: 5/5mil
Minimum aperture: 0.25mm
Technical features: impedance control
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