PCB industry pattern and development trend

In 2017, the output value of the top 40 global PCB manufacturers accounted for more than 60% of the entire industry, compared with 15.9% in 2016, and continues to expand market share. Prismark expects the PCB industry to maintain steady growth in 2018, with a CAGR of around 3.2% from 2017 to 2022.

The growth rate of China’s PCB industry is slightly higher than the growth rate of the global PCB industry. Prismark expects China’s PCB industry to grow by 9.6% in 2017, and the compound annual growth rate from 2017 to 2022 is about 3.7%. The trend of the global PCB industry shifting to Asia, especially China, remains unchanged. Prismark expects the PCB production value of China’s PCB industry to account for approximately 50.5% of the global production value in 2017, while China, Taiwan, South Korea and other parts of Asia are behind.

China’s PCB has a relatively mature industrial chain, and national policies are conducive to industrial development. The National 13th Five-Year Plan points to accelerating the construction of a new generation of high-speed, mobile and secure information infrastructure, whether it is to popularize high-speed wireless networks, new energy vehicles, and actively promote intelligent manufacturing, artificial intelligence, and fifth-generation mobile communications. 5G) and ultra-broadband related technology research, or layout of future network architecture, technical system and security system are inseparable from PCB products, so the internal growth of China’s PCB industry is still significant.

With the tight supply of raw materials in the PCB market in China and the increasingly stricter environmental protection policies, the threshold of the PCB industry is gradually increasing, the concentration of the industry is becoming larger, and enterprises with stable strength will win more market space.

From the perspective of industrial development, in the product type, the global PCB industry is moving toward high precision, high density and high reliability, reducing volume, reducing cost, improving performance, light weight, increasing productivity and reducing environmental impact. In order to adapt to the development of downstream electronic terminal equipment industry, HDI, FPC, rigid-flex board and IC carrier board will become the key development direction of the industry in the future.